Factory wholesale price for Har-2350 Sprocket Export to Ireland

More Details

CONTACT US:
HAIHUANG INDUSTRIAL ZONE, MIDDLE SECTION OF ANLIN RD,ANYANG,HENAN,CHINA.
Phone: +86 372 5368865
Cell/whatsapp/wechat: +86 186 3723 8677
Fax: +86 372 5368865
Email: [email protected]

Textured Soy Protein Production Line

Introduction of Textured Fiber Soy Protein Production Line:
The production line mainly take low-temperature soybean meal, peanut meal, wheat gluten, isolated soya etc as raw material. The textured fiber soya protein production line is used to produce textured protein and fiber protein which feature high strength and high toughness. The Shapes of textured and fiber protein can be cylinder, chunk, flakes, rounded grain, square grain etc.
Features of Textured Fiber Soy Protein Production Line:
1.Combined functional screw to realize parameter precisely controlled.
2.The texture and fiber protein is chewy, easier to be flavored and can bear long time cooking.
3.Complete production line reasonable design and control system to makes sure high quality textured and fiber protein.
Construction of Textured Fiber Soy Protein Production Line:
Flour Mixer
Spiral Elevator
Extruder
Cooling Vibration
Conveyor
5-layers Fuel Oven
5 -meters Cooling Machine
5-meters Cooling Conveyor

More Info: https://extrusion-machines.com/textured-soy-protein-production-line/

https://www.hifoodextruder.com/Products/30/

About Hiwant International:
Henan Hiwant International Co., Ltd is a technology-based manufacturer and trader of food extrusion machines. We are service oriented expert designer in system integration. We not only provide systematic solution for complete production of food extrusion machine processing line, but also design tailor-made projects. With many patents and technology breakthrough, We have most advanced test center which integrates experiments, demonstration, and training. It means We can test and do experiments according to clients’ new ideas or requirements.
Our food extrusion machinery lines are widely used in: puffed snack food extruder, breakfast cereals extruder, fiber protein extruder, bread crumbs extruder, pet/aquatic feed extruder, modified starch extruder, artificial/nutritional rice extruder, and other food , biological and chemical industry.
Our Machines have been exported to Europe, America, East Africa, and so on. We got good feed back and comments from clients all over the world. Compared with Europe and US machinery, our technology and quality are similar, but more cost effective. The operation of our machine is simpler and maintenance is easier.
Our Mission is to provide you with most professional and heart-felt services and most value-added solution on food extrusion machines. Hope to have long lasting friendship and share the joy of success with you.

More Information: https://www.hiwant.com

■ Patent Coulomb-Force E-Chuck (Electrostatic Chuck) :

​Patent Coulomb-Force E-Chuck has been developed long time and has dozens of international patents.

Advanced technology enclose electrical field in the E-Chuck. E-Chuck become a move-free carrier. After adhesion setting, Move-Free Supporter can disconnect the power supply and still keep adhesion force. Move-Free support can support hardness or shape reinforcements for thin wafer or glass panel.

Patent Coulomb-Force E-Chuck has best characteristics than many electrostatic chucks under long-term advanced researches and developments. Patent Coulomb-Force E-Chuck is a ideal handling tool for soft and thin materials.

■ Adsorbable Material
(1) Metal conductor (e.g., copper foil)
(2) Semiconductors (e.g., silicon, GaAs)
(3) Insulators (e.g., paper, glass panel)
(4) Porous objects.
(5) The adsorption force per unit area is related to the adsorption material and the contact surface smoothness.
(6) Material ranking of the adsorption force per unit area is : Metal 1st, Semiconductors 2nd, Insulator 3rd.

■ Operational Environment
(1) Atmospheric Pressure.
(2) Vacuum Environment.

■ What’s Electrostatic Chuck
The electrostatic chuck is a device for generating an attracting force between an electrode and an object at a voltage applied to the electrode.

​​■ Varieties of Electrostatic Chuck
(1) Coulomb-Fore Electrostatic Chuck
(2) Johnsen-Rahbek Electrostatic Chuck, or JR Electrostatic Chuck

■ Features of Patent Coulomb-Force E-Chuck
(1) Coulomb-Force Electrostatic Chuck.
(2) Patent Coulomb-Force E-Chuck was developed long time and has dozens of international patents.
(3) Stable and uniform adhesion force is achieved by applying the voltage to the electrode
(4) Apply lowest voltage to keep maximum adhesion force.
(5) Because voltage potential of object backside is zero, adhesion will not affect the backside circuits.
(6) Be able to adhere various materials : metal / semiconductor / glass / paper / porous materials.
(7) Work normally in a vacuum environments and general atmospheric environments.
(8) Cab define adhesion area and non-adhesion area. Non-adhesion area can define other functions.
(9) Can be made by different substrates. Such as stainless, aluminum, ceramic, semiconductor wafer or glass.
(10) Can be customized into various sizes and thicknesses for customer’s applications.
(11) Advanced technology enclose electrical field in the E-Chuck. E-Chuck become as move-free carrier.
(12) After adhesion setting, Move-Free Supporter can move freely even disconnecting the power supply. Move-Free support can support hardness or shape reinforcements for thin wafer or glass panel.

■ Main Handling Applications
​(1) Thin and large size flat glass.
(2) Semiconductor thin wafers.
(3) Big Size Wafer Handling and Moving.
(4) Warp wafers.
(5) Move-Free Shape Reinforcement Carrier (Eg, 4″ Wafer-on-6″ E-Chuck).
(6) Soft copper foil.
(7) Soft film.
(8) Curved glass.
(9) Vacuum Lamination for OLED or Touch Panel.
(10) Vacuum deposition.

■ Main Products

① (Move-Free) Thin Wafer Supporter
1. Be able to keep adhesion without power source connection.
2. Need connect controller for about 30 seconds to switch the adhesion state.
3. After adhesion setting, move-free supporter can keep adhesion status even disconnecting power.
4. Maximum operating temperature: 250 degrees centigrade.
5. Suitable for soft and thin object carriers. (Eg, thin wafer, thin glass panel, 4″wafer-on-6″chuck Shape Reinforcement Carrier).

② (Wired) Stage Holder
1. Real time power switch to set adsorption or release.
2. Maximum operating temperature: 200 degrees centigrade (E-Chuck surface).
3. Suitable for automation equipments. (Eg, curved glass, borderless screen, OLED vacuum Lamination.)

③ (Cordless) Palm:
1. Use battery as power source.
2. Suitable to adhere small and lightweight objects. (Eg, ​ 12 “wafers, 7″ flat glass.)

④ Other Custom E-Chuck:
1. Patent Cordless Holder (built-in battery, suitable for conveying lightweight objects)
2. Patent Electric Belt (curved cylinder shape E-Chuck) (Eg, Paper Printer.)
3. Anti-wrinkle E-Chuck (Eg, soft copper foil.)
​4. 3D Curved E-Chuck.

■ Demo Video :
Patent Coulomb-Force E-Chuck (Electrostatic Chuck) for Thin/Warp Materials and Vacuum Environments

⓪Patent Advanced E-Chuck Ability Demo : Adsorb Conductor, Semiconductor, Insulator

①(Move-Free) Supporter : Thin Warpage Wafer Support Handling

②(Wired) Stage Holder : Glass & Paper Adhesion

③(Cordless) Palm : Semiconductor Wafer Adsorption

④Custom : Copper Foil Adhesion

Contact info :
E-mail : [email protected]
EDRAGON TECHNOLOGY CORPORATION